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Reasons for welding defects in Yantai SMT processing

Published: 2025-04-14 Views: 0

The pursuit of quality is a necessary requirement for modern enterprises. The quality of products directly affects the survival of a company, and this is especially true for SMT processing in Yantai. Because circuit boards are high-precision products, with densely packed electronic components and intricate circuit paths, a problem in any single spot can directly lead to the circuit board failing to function. Poor soldering is the most common problem. Especially since modern large-scale SMT processing factories use mechanical equipment for mass production, although their precision and efficiency are improved compared to manual soldering, poor soldering phenomena are still inevitable. Below, Yantai Zhange Electronics summarizes the main reasons for poor circuit board soldering:

Reasons for Poor Soldering: We have summarized seventeen points below, including common ones and also very rare ones, but every one of these reasons is possible. They specifically include: empty solder (unsoldered), short circuit, tombstoning (drawbridging), missing part, solder ball, lifted lead, high part, wrong part, reverse part, inverted part (white side up), cold solder, misalignment, insufficient solder, damaged part, excess solder, sideways part, and gold finger solder sticking.

The above is Yantai Zhange Electronics Co., Ltd.'s summary of the reasons for poor soldering, which basically covers all aspects. Furthermore, for SMT processing factories, after mass production is completed, detailed inspections are necessary. If poor soldering is found, the reasons can be identified by referring to the summary above.

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