Requirements for SMT processing and sampling in Yantai for surface mount quality

In SMT prototyping or PCBA processing in Yantai, the key points of quality control lie in the initial steps of the SMT assembly factory, such as preliminary incoming inspection, BGA chip storage, and solder paste printing. Ensuring quality in these first three steps will guarantee that the yield rate in later stages will not be low.

To ensure the quality of SMT assembly, SMT processing factories should consider three essential factors: the correctness of the mounted components, the accuracy of the placement position, and the appropriateness of the placement pressure (placement height).

1. Characteristic markings such as the type, model, and nominal value of the components must meet the requirements of the product assembly drawing and parts list.

2. At least half of the solder terminals or pins of the components mounted on the multi-layer circuit board need to be immersed in the solder paste. Generally, when placing components, the amount of solder paste squeezed out should be less than 0.2mm; for fine-pitch components, the amount of solder paste squeezed out should be less than 0.1mm.

3. The solder terminals or pins of the components should be aligned and centered with the pad pattern as much as possible. During reflow soldering, the molten solder gives the components a self-aligning effect, allowing for some deviation in the placement position of the components.

That's all for today's introduction. I hope it can be helpful to everyone. If you have any needs, please feel free to consult Yantai Zhange Electronics. The company always adheres to the guidance of "customer satisfaction," committing to providing customers with customized products and one-stop services, supporting value-added development, and creating long-term value for partners.